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Durapot 865 500°F Highly Thermally Conductive, Potting Compound
● Durapot™ 865 was designed for applications requiring high heat flows and rapid thermal dissipation. Just mix, apply and cure at room temp. for excellent chemical resistance and high temp. stability. Used for thermally conductive casting, embedding, impregnating and encapsulation.
Product Details
Durapot™ 865 was designed for applications requiring high heat flows and rapid thermal dissipation. Just mix, apply and cure at room temp. for excellent chemical resistance and high temp. stability. Used for thermally conductive casting, embedding, impregnating and encapsulation.
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Copyright © 2012-2025 Dongguan Hongyue Trading Co., Ltd.-Vulcanization. All Rights reserved