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Duralco 4538 Electric Resistant Epoxy Resin

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Epoxy Resin Adhesive Classification Details Text

Duralco 132 500°F Aluminum Filled Epoxy

● Aluminum metal filled epoxy that cures at room temp to form machinable, thermally conductive bond lines. Duralco™ 132 offers the maximum conductivity available in a 500ºF epoxy system. Can be supplied as a non-sag putty for heat tracing applications. Ideal for applications requiring rapid heating and cooling and can be used for any bonding, assembling, heat tacking applications

Duralco 133 600°F Aluminum Filled Epoxy

● Duralco™ 133 is a two component, heat curing, Aluminum filled, Conductive epoxy. Suitable for high temp. tooling and applications requiring machinable repairs. Duralco 133 combines the excellent properties of Duralco 132 with Cotronics' higher temperature epoxy system to provide up to 600ºF service.

Duralco 4460 Ultra-High Temperature Epoxy Resin

● Duralco™ 4460 is easy to use. Just mix resin and hardener to form a low viscosity liquid that easily flows into fine details, cracks and crevices. ● 4460 has excellent adhesion to metals, plastics, ceramics and glass, high bond strength, low moisture absorption, high temp. stability, low shrinkage and excellent chemical, electrical and radiation resistance. ● Ideal for ultra thin bond lines, sealing porous materials and protecting, bonding and coating critical electronic components, strain gauges, etc.

Duralco 4700 Ultra-High Temperature Epoxy Resin

● Duralco™ 4700 unique properties stem from Cotronics' cross liked, inorganic- organic polymer system. Simply mix resin and hardener and follow with a heat cure (250°F min.). ● Offers high electrical resistance, low moisture absorption, high temp. stability, high bond strength, low shrinkage and excellent chemical solvent and radiation resistance. ● Ideal for sealing electrical connections, high performance bonding, potting and repairing in automotive, aerospace, nuclear, chemical, production and laboratory applications.

Duralco 4703 Ultra-High Temperature Epoxy Resin

● Duralco™ 4703 is Cotronics' high temp. resins reinforced with ceramic and metallic fibers and particles, resulting in the ultimate stability in high temp. environments. It is easily machined to close tolerances and will repair and rebuild worn or cracked composites, dies, fixtures, jigs, etc. ● Electrically non-conductive and is resistant to most chemicals, solvents, acids and bases. ● Applications Include bonding, potting, injection molding, matched dies, vacuum forming dies, extrusion dies and tooling. Use up to 650°F.

Duraseal 1531 700°F Silicone Putty

● Duraseal™ 1531 One Component, Non Sag Putty fills in voids, forms flexible gaskets, repairs and seals. Ideal for sealing pipes, flanges, stacks and high temp. equipment. ● No mixing, measuring or mess. No harsh or acidic odors. No special surface preparation. Will not corrode metal surfaces and is safe to use with the most delicate electronic components. ● Duraseal 1531 offers flexibility, high bond strength, high temperature stability, thermal shock resistance, chemical resistance, low shrinkage and excellent electrical properties.

Duraseal 1532 650°F Clear, Thin Putty

● Duraseal™ 1532 Clear, Thin Putty with Excellent Spreadability. Ideal for high temperature bonding, waterproofing, sealing, impregnating, coating or vibration dampening applications. ● Excellent electrical insulation properties makes it the ideal choice for cable splicing, electrical isolation, repairs, potting, etc.

Duraseal 1533 550ºF 5 Minute Casting Compound

● Duraseal™ 1533 flows into the finest cracks and crevices to form stress free, highly detailed molds, coatings and encapsulations. ● Easy to use 1 to 1 mix ratio. Just mix and pour. No need for vacuum degassing. ● Duraseal 1533 will cure in 5-15 minutes at room temperature to form a flexible material with excellent mechanical properties and resistance to chemicals, solvents and moisture. Meets stringent UL 94V-0 flame retardant requirements. ● Applications include: producing finely detailed molds, encapsulating electronic components, forming flexible parts, and stress free potting.

Nancy Dai　

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